HD64F3437STF16V Renesas Electronics America, HD64F3437STF16V Datasheet - Page 406

• Manufacturer Part Number: HD64F3437STF16V
• Description: MCU 3/5V 60K PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300r

Specifications of HD64F3437STF16V

• Core Processor: H8/300
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: Host Interface, I²C, SCI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 74
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

18.3.3
An effective way to assure the data holding characteristics of the programmed chips is to bake
them at 150˚C, then screen them for data errors. This procedure quickly eliminates chips with
PROM memory cells prone to early failure.
Figure 18.7 shows the recommended screening procedure.
If a series of write errors occurs while the same PROM programmer is in use, stop programming
and check the PROM programmer and socket adapter for defects.
Please inform Hitachi of any abnormal conditions noted during programming or in screening of
program data after high-temperature baking.
374
Reliability of Programmed Data
Figure 18.7 Recommended Screening Procedure
Bake with power off
125 to 150 C, 24 to 48Hr
Read and check program
Write and verify program
Mount