UPD70F3785GJ-GAE-AX Renesas Electronics America, UPD70F3785GJ-GAE-AX Datasheet - Page 1752

• Manufacturer Part Number: UPD70F3785GJ-GAE-AX
• Description: MCU 32BIT V850ES/JX3-E 144-LQFP
• Manufacturer: Renesas Electronics America
• Series: V850ES/Jx3-Er

Specifications of UPD70F3785GJ-GAE-AX

• Core Processor: RISC
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: CSI, EBI/EMI, Ethernet, I²C, UART/USART, USB
• Peripherals: DMA, LVD, PWM, WDT
• Number Of I /o: 100
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 124K x 8
• Voltage - Supply (vcc/vdd): 2.85 V ~ 3.6 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Note
Caution Do not use different soldering methods together (except for partial heating).
Remarks 1. Products with –AX at the end of the part number are lead-free products.
1750
Infrared reflow
Partial heating
Soldering Method
μ
μ
μ
PD70F3784GJ-GAE-AX: 144-pin plastic LQFP (fine pitch) (20 × 20 mm)
PD70F3785GJ-GAE-AX: 144-pin plastic LQFP (fine pitch) (20 × 20 mm)
PD70F3786GJ-GAE-AX: 144-pin plastic LQFP (fine pitch) (20 × 20 mm)
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
2. For soldering methods and conditions other than those recommended, please contact an NEC
Electronics sales representative.
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: 3 times or less, Exposure limit: 7 days
20 to 72 hours)
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
Table 37-1. Surface Mounting Type Soldering Conditions
CHAPTER 35 RECOMMENDED SOLDERING CONDITIONS
User’s Manual U19601EJ2V0UD
Soldering Conditions
Note
(after that, prebake at 125°C for
IR60-207-3
Condition Symbol
Recommended
−