EP1S20F780I6N Altera, EP1S20F780I6N Datasheet - Page 688

• Manufacturer Part Number: EP1S20F780I6N
• Description: IC STRATIX FPGA 20K LE 780-FBGA
• Manufacturer: Altera
• Series: Stratix®r

Specifications of EP1S20F780I6N

• Number Of Logic Elements/cells: 18460
• Number Of Labs/clbs: 1846
• Total Ram Bits: 1669248
• Number Of I /o: 586
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 780-FBGA
• Family Name: Stratix
• Number Of Logic Blocks/elements: 18460
• # I/os (max): 586
• Frequency (max): 450.05MHz
• Process Technology: 0.13um (CMOS)
• Operating Supply Voltage (typ): 1.5V
• Logic Cells: 18460
• Ram Bits: 1669248
• Operating Supply Voltage (min): 1.425V
• Operating Supply Voltage (max): 1.575V
• Operating Temp Range: -40C to 100C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 780
• Package Type: FC-FBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of Gates: -
• Lead Free Status / Rohs Status: Compliant

General Architecture
10–4
Stratix Device Handbook, Volume 2
f
Stratix and Stratix GX device MultiTrack interconnect resources are
described in
Direct link routing saves row routing resources while providing fast
communication paths between resource blocks. Direct link interconnects
allow an LAB, digital signal processing (DSP) block, or TriMatrix
memory block to drive data into the local interconnect of its left and right
neighbors. LABs, DSP blocks, and TriMatrix memory blocks can also use
direct link interconnects to drive data back into themselves for feedback.
The Quartus II software automatically uses these routing resources to
enhance design performance.
For more information about LE architecture and the MultiTrack
interconnect structure in Stratix and Stratix GX devices, see the Stratix
Device Family Data Sheet section of the Stratix Device Handbook, Volume 1
or the Stratix GX Device Family Data Sheet section of the Stratix GX Device
Handbook, Volume 1.
DirectDrive Technology
When using APEX II or APE 20K devices, you must place critical paths in
the same MegaLAB
should place critical paths in the same MegaLAB structure for optimal
performance. However, this restriction does not exist in Stratix and
Stratix GX devices because they do not contain MegaLAB structures.
With the new DirectDrive
the actual distance between the source and destination of a path is the
most important criteria for meeting timing performance. DirectDrive
technology ensures that the same routing resources are available to each
design block, regardless of its location in the device.
Row
Row
Row
Row
Column
Column
Column
Routing Type
Table 10–2. Stratix & Stratix GX Device MultiTrack Interconnect Resources
Table
Direct link
R4
R8
R24
C4
C8
C16
Interconnect
10–2.
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column to improve performance. Additionally, you
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technology in Stratix and Stratix GX devices,
Adjacent LABs and/or blocks
Four LAB units horizontally
Eight LAB units horizontally
Horizontal routing across the width of the device
Four LAB units vertically
Eight LAB units vertically
Vertical routing across the length of the device
Span
Altera Corporation
July 2005
TM