HD6417705F133BV Renesas Electronics America, HD6417705F133BV Datasheet - Page 310

MPU 3V 0K PB-FREE 208 FP

HD6417705F133BV

Manufacturer Part Number
HD6417705F133BV
Description
MPU 3V 0K PB-FREE 208 FP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7700r
Datasheet

Specifications of HD6417705F133BV

Core Processor
SH-3
Core Size
32-Bit
Speed
133MHz
Connectivity
EBI/EMI, FIFO, IrDA, SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
105
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
208-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Rev. 2.00, 09/03, page 262 of 690
Single Address Mode
In single address mode, either the transfer source or transfer destination peripheral device is
accessed (selected) by means of the DACK signal, and the other device is accessed by address.
In this mode, the DMAC performs one DMA transfer in one bus cycle, accessing one of the
external devices by outputting the DACK transfer request acknowledge signal to it, and at the
same time outputting an address to the other device involved in the transfer. For example, in
the case of transfer between external memory and an external device with DACK shown in
figure 8.7, when the external device outputs data to the data bus, that data is written to the
external memory in the same bus cycle.
(Active-Low)
D31 to D0
A25 to A0
Figure 8.6 Example of DMA Transfer Timing in Dual Mode
(Source: Ordinary Memory, Destination: Ordinary Memory)
DACKn
CKIO
WEn
CSn
Note: In transfer between external memories, with DACK output in the read cycle,
RD
DACK output timing is the same as that of CSn.
Data read cycle
Transfer source
(1st cycle)
address
Data write cycle
Transfer destination
(2nd cycle)
address

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