HD6417705F133BV Renesas Electronics America, HD6417705F133BV Datasheet - Page 707

• Manufacturer Part Number: HD6417705F133BV
• Description: MPU 3V 0K PB-FREE 208 FP
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7700r

Specifications of HD6417705F133BV

• Core Processor: SH-3
• Core Size: 32-Bit
• Speed: 133MHz
• Connectivity: EBI/EMI, FIFO, IrDA, SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 105
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 1.6 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 208-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

A12/A11 *
D31 to D0
A25 to A0
DACKn *
RASU/L
CASU/L
RD/WR
DQMxx
CKIO
CKE
Figure 25.35 Synchronous DRAM Burst Write Bus Cycle (Single Write
CSn
BS
1
2
Different Row Address, TRCD = 1 Cycle, TRWL = 1 Cycle)
(Bank Active Mode: PRE + ACTV + WRITE Commands,
t
t
t
t
t
t
t
Notes: 1. Address pin to be connected to A10 of SDRAM.
AD1
AD1
CSD1
RWD1
RASD1
DACD
DQMD1
Tp
2. DACKn is a waveform when active-low is specified.
t
t
t
AD1
RWD1
RASD1
Row address
Tpw
t
RASD1
Tr
t
t
t
t
t
t
t
AD1
AD1
RASD1
CASD1
RWD1
BSD
WDD2
Tc1
(High)
t
t
AD1
WDH2
Tc2
Column
address
Write command
Rev. 2.00, 09/03, page 659 of 690
t
AD1
Tc3
(1-4)
t
t
AD1
WDD2
Tc4
t
t
t
t
t
t
t
t
t
t
RWD1
DACD
AD1
AD1
RASD1
CASD1
WDH2
CSD1
BSD
DQMD1
4)