MC9S12E128CPVE Freescale Semiconductor, MC9S12E128CPVE Datasheet - Page 85

IC MCU 128K FLASH 25MHZ 112-LQFP

MC9S12E128CPVE

Manufacturer Part Number
MC9S12E128CPVE
Description
IC MCU 128K FLASH 25MHZ 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheets

Specifications of MC9S12E128CPVE

Core Processor
HCS12
Core Size
16-Bit
Speed
25MHz
Connectivity
EBI/EMI, I²C, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
91
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 2.75 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
112-LQFP
Processor Series
S12E
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
8 KB
Interface Type
SCI/SPI
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
92
Number Of Timers
12
Operating Supply Voltage
3.135 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Minimum Operating Temperature
- 40 C
On-chip Adc
16-ch x 10-bit
On-chip Dac
2-ch x 8-bit
Controller Family/series
HCS12/S12X
No. Of I/o's
90
Ram Memory Size
8KB
Cpu Speed
25MHz
No. Of Timers
4
Embedded Interface Type
I2C, SCI, SPI
Rohs Compliant
Yes
For Use With
M68EVB912E128 - BOARD EVAL FOR MC9S12E128/64
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Chapter 2
128 Kbyte Flash Module (FTS128K1V1)
2.1
The FTS128K1 module implements a 128 Kbyte Flash (nonvolatile) memory. The Flash memory contains
one array of 128 Kbytes organized as 1024 rows of 128 bytes with an erase sector size of eight rows (1024
bytes). The Flash array may be read as either bytes, aligned words, or misaligned words. Read access time
is one bus cycle for byte and aligned word, and two bus cycles for misaligned words.
The Flash array is ideal for program and data storage for single-supply applications allowing for field
reprogramming without requiring external voltage sources for program or erase. Program and erase
functions are controlled by a command driven interface. The Flash module supports both mass erase and
sector erase. An erased bit reads 1 and a programmed bit reads 0. The high voltage required to program
and erase is generated internally. It is not possible to read from a Flash array while it is being erased or
programmed.
2.1.1
Command Write Sequence — A three-step MCU instruction sequence to program, erase, or erase verify
the Flash array memory.
2.1.2
Freescale Semiconductor
128 Kbytes of Flash memory comprised of one 128 Kbyte array divided into 128 sectors of 1024
bytes
Automated program and erase algorithm
Interrupts on Flash command completion and command buffer empty
Fast sector erase and word program operation
2-stage command pipeline for faster multi-word program times
Flexible protection scheme to prevent accidental program or erase
Single power supply for Flash program and erase operations
Security feature to prevent unauthorized access to the Flash array memory
Introduction
Glossary
Features
A Flash word must be in the erased state before being programmed.
Cumulative programming of bits within a Flash word is not allowed.
MC9S12E128 Data Sheet, Rev. 1.07
CAUTION
85

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