DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 1024

• Manufacturer Part Number: DF2367VF33
• Description: MCU 3V 384K 128-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2367VF33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 84
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 128-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2367VF33; HD64F2367VF33

Appendix
Rev.6.00 Mar. 18, 2009 Page 964 of 980
REJ09B0050-0600
Instruction
LDC
@ERs,CCR
LDC
@ERs,EXR
LDC@(d:16,E
Rs),CCR
LDC@(d:16,E
Rs),EXR
LDC@(d:32,E
Rs),CCR
LDC@(d:32,E
Rs),EXR
LDC
@ERs+,CCR
LDC
@ERs+,EXR
LDC
@aa:16,CCR
LDC
@aa:16,EXR
LDC
@aa:32,CCR
LDC
@aa:32,EXR
LDM.L @SP+,
(ERn-ERn+1)
*
LDM.L @SP+,
(ERn-ERn+2)
*
LDM.L @SP+,
(ERn-ERn+3)
*
LDMAC
ERs,MACH
8
8
8
1
R:W 2nd R:W
R:W 2nd R:W
R:W 2nd R:W 3rd R:W
R:W 2nd R:W 3rd R:W
R:W 2nd R:W 3rd R:W 4th R:W 5th R:W
R:W 2nd R:W 3rd R:W 4th R:W 5th R:W
R:W 2nd R:W
R:W 2nd R:W
R:W 2nd R:W 3rd R:W
R:W 2nd R:W 3rd R:W
R:W 2nd R:W 3rd R:W 4th R:W
R:W 2nd R:W 3rd R:W 4th R:W
R:W 2nd R:W
R:W 2nd R:W
R:W 2nd R:W
R:W
NEXT
2
NEXT
NEXT
NEXT
NEXT
NEXT
NEXT
NEXT
1 state of
internal
operation
3
R:W EA
R:W EA
NEXT
NEXT
1 state of
internal
operation
1 state of
internal
operation
NEXT
NEXT
1 state of
internal
operation
1 state of
internal
operation
1 state of
internal
operation
4
R:W EA
R:W EA
R:W EA
R:W EA
R:W EA
R:W EA
NEXT
NEXT
R:W:M
Stack
(H) *
R:W:M
Stack
(H) *
R:W:M
Stack
(H) *
2
2
2
5
NEXT
NEXT
R:W EA
R:W EA
R:W
Stack (L)
*
R:W
Stack (L)
*
R:W
Stack (L)
*
2
2
2
6
R:W EA
R:W EA
7
8
9