DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 970

• Manufacturer Part Number: DF2367VF33
• Description: MCU 3V 384K 128-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2367VF33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 84
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 128-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2367VF33; HD64F2367VF33

Section 25 Electrical Characteristics
25.1.4
Table 25.11 A/D Conversion Characteristics
Conditions: V
Item
Resolution
Conversion time
Analog input capacitance
Permissible signal source impedance
Nonlinearity error
Offset error
Full-scale error
Quantization error
Absolute accuracy
25.1.5
Table 25.12 D/A Conversion Characteristics
Conditions: V
Item
Resolution
Conversion time
Absolute accuracy
Rev.6.00 Mar. 18, 2009 Page 910 of 980
REJ09B0050-0600
A/D Conversion Characteristics
D/A Conversion Characteristics
φ = 8 MHz to 33 MHz, T
T
φ = 8 MHz to 33 MHz, T
T
a
a
CC
CC
= –40°C to +85°C (wide-range specifications)
= –40°C to +85°C (wide-range specifications)
= 3.0 V to 3.6 V, AV
= 3.0 V to 3.6 V, AV
Min
8
—
—
—
a
a
CC
CC
= –20°C to +75°C (regular specifications),
= –20°C to +75°C (regular specifications),
= 3.0 V to 3.6 V, V
= 3.0 V to 3.6 V, V
Typ
8
—
±2.0
—
Min
10
8.1
—
—
—
—
—
—
—
Max
8
10
±3.0
±2.0
Typ
10
—
—
—
—
—
—
—
—
ref
ref
= 3.0 V to AV
= 3.0 V to AV
LSB
LSB
Unit
Bit
μs
Max
10
—
20
5
±5.5
±5.5
±5.5
±0.5
±6.0
Test Conditions
20 pF capacitive load
2 MΩ resistive load
4 MΩ resistive load
CC
CC
, V
, V
SS
SS
= AV
= AV
Unit
Bit
μs
pF
kΩ
LSB
LSB
LSB
LSB
LSB
SS
SS
= 0 V,
= 0 V,