DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 249

• Manufacturer Part Number: DF2367VF33
• Description: MCU 3V 384K 128-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2367VF33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 84
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 128-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2367VF33; HD64F2367VF33

When DDS = 0 : When DRAM space is accessed in DMAC single address transfer mode, full
access (normal access) is always performed. With the DRAM interface, the DACK output goes
low from the T
In modes other than DMAC single address transfer mode, burst access can be used when
accessing DRAM space.
Figure 6.41 shows the DACK output timing for the DRAM interface when DDS = 0.
Read
Write
Note: n = 2, 3
Figure 6.41 Example of DACK Output Timing when DDS = 0 (RAST = 0, CAST = 1)
φ
Address bus
RASn (CSn)
UCAS, LCAS
WE (HWR)
OE (RD)
Data bus
WE (HWR)
OE (RD)
Data bus
DACK
r
state.
T
p
Row address
High
High
T
r
T
Rev.6.00 Mar. 18, 2009 Page 189 of 980
c1
Column address
Section 6 Bus Controller (BSC)
T
c2
REJ09B0050-0600
T
c3