DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 222

• Manufacturer Part Number: DF2367VF33
• Description: MCU 3V 384K 128-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2367VF33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 84
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 128-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2367VF33; HD64F2367VF33

Section 6 Bus Controller (BSC)
6.5.5
The read strobe (RD) timing can be changed for individual areas by setting bits RDN7 to RDN0 to
1 in RDNCR. Figure 6.18 shows an example of the timing when the read strobe timing is changed
in basic bus 3-state access space.
When the DMAC is used in single address mode, note that if the RD timing is changed by setting
RDNn to 1, the RD timing will change relative to the rise of DACK.
Rev.6.00 Mar. 18, 2009 Page 162 of 980
REJ09B0050-0600
Read
Write
Notes: 1. Downward arrows indicate the timing of WAIT pin sampling.
Read Strobe (RD) Timing
2. When RDN = 0
WAIT
Address bus
AS
RD
Data bus
HWR, LWR
Data bus
φ
Figure 6.17 Example of Wait State Insertion Timing
T
1
By program wait
T
2
T
w
Write data
T
By WAIT pin
w
T
w
Read data
T
3