DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 1031

MCU 3V 384K 128-QFP

DF2367VF33

Manufacturer Part Number
DF2367VF33
Description
MCU 3V 384K 128-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2367VF33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
84
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2367VF33
HD64F2367VF33

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2367VF33V
Manufacturer:
Renesas Electronics America
Quantity:
135
Part Number:
DF2367VF33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
DF2367VF33WV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Instruction
SHAR.B #2,Rd R:W
SHAR.W Rd
SHAR.W
#2,Rd
SHAR.L ERd R:W
SHAR.L
#2,ERd
SHLL.B Rd
SHLL.B #2,Rd R:W
SHLL.W Rd
SHLL.W #2,Rd R:W
SHLL.L ERd
SHLL.L
#2,ERd
SHLR.B Rd
SHLR.B #2,Rd R:W
SHLR.W Rd
SHLR.W
#2,Rd
SHLR.L ERd
SHLR.L
#2,ERd
SLEEP
1
NEXT
R:W
NEXT
R:W
NEXT
NEXT
R:W
NEXT
R:W
NEXT
NEXT
R:W
NEXT
NEXT
R:W
NEXT
R:W
NEXT
R:W
NEXT
NEXT
R:W
NEXT
R:W
NEXT
R:W
NEXT
R:W
NEXT
R:W
NEXT
2
Internal
operation:
M
3
4
5
Rev.6.00 Mar. 18, 2009 Page 971 of 980
6
7
REJ09B0050-0600
8
Appendix
9

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