DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 938

MCU 3V 384K 128-QFP

DF2367VF33

Manufacturer Part Number
DF2367VF33
Description
MCU 3V 384K 128-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2367VF33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
84
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2367VF33
HD64F2367VF33

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2367VF33V
Manufacturer:
Renesas Electronics America
Quantity:
135
Part Number:
DF2367VF33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
DF2367VF33WV
Manufacturer:
Renesas Electronics America
Quantity:
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Section 25 Electrical Characteristics
(1) Clock Timing
Table 25.5 Clock Timing
Conditions: V
Item
Clock cycle time
Clock pulse high width
Clock pulse low width
Clock rise time
Clock fall time
Reset oscillation stabilization
time (crystal)
Software standby oscillation
stabilization time (crystal)
External clock output delay
stabilization time
Rev.6.00 Mar. 18, 2009 Page 878 of 980
REJ09B0050-0600
φ = 8 MHz to 33 MHz, T
T
a
CC
= –40°C to +85°C (wide-range specifications)
= 3.0 V to 3.6 V, AV
Figure 25.2 System Clock Timing
Symbol
t
t
t
t
t
t
t
t
cyc
CH
CL
Cr
Cf
OSC1
OSC2
DEXT
a
CC
= –20°C to +75°C (regular specifications),
t
CH
= 3.0 V to 3.6 V, V
t
cyc
Min
30.3
10
10
10
10
1
t
Cf
t
CL
Max
125
5
5
ref
t
Cr
= 3.0 V to AV
Unit
ns
ns
ns
ns
ns
ms
ms
ms
CC
, V
Test Conditions
Figure 25.2
Figure 25.2
Figure 25.3(1)
Figure 25.3(2)
Figure 25.3(1)
SS
= AV
SS
= 0 V,

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