DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 241

MCU 3V 384K 128-QFP

DF2367VF33

Manufacturer Part Number
DF2367VF33
Description
MCU 3V 384K 128-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2367VF33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
84
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2367VF33
HD64F2367VF33

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• RAS Up Mode
φ
Address bus
RASn (CSn)
UCAS, LCAS
RD
OE
Data bus
Note: n = 2, 3
To select RAS up mode, clear the RCDM bit to 0 in DRAMCR. Each time access to DRAM
space is interrupted and another space is accessed, the RAS signal goes high again. Burst
operation is only performed if DRAM space is continuous. Figure 6.32 shows an example of
the timing in RAS up mode.
Figure 6.32 Example of Operation Timing in RAS Up Mode
T
Row address
p
DRAM space read
T
r
(RAST = 0, CAST = 0)
Column address 1 Column address 2
T
c1
T
c2
Rev.6.00 Mar. 18, 2009 Page 181 of 980
T
DRAM space
c1
read
Section 6 Bus Controller (BSC)
T
c2
External address
Normal space
T
1
REJ09B0050-0600
read
T
2

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