DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 223

MCU 3V 384K 128-QFP

DF2367VF33

Manufacturer Part Number
DF2367VF33
Description
MCU 3V 384K 128-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2367VF33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
84
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2367VF33
HD64F2367VF33

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Part Number
Manufacturer
Quantity
Price
Part Number:
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Manufacturer:
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Manufacturer:
Renesas Electronics America
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6.5.6
Some external I/O devices require a setup time and hold time between address and CS signals and
strobe signals such as RD, HWR, and LWR. Settings can be made in the CSACR register to insert
states in which only the CS, AS, and address signals are asserted before and after a basic bus space
access cycle. Extension of the CS assertion period can be set for individual areas. With the CS
assertion extension period in write access, the data setup and hold times are less stringent since the
write data is output to the data bus.
Figure 6.19 shows an example of the timing when the CS assertion period is extended in basic bus
3-state access space.
RDNn = 0
RDNn = 1
Extension of Chip Select (CS) Assertion Period
φ
Address bus
CSn
AS
RD
Data bus
RD
Data bus
DACK
Figure 6.18 Example of Read Strobe Timing
T
1
Rev.6.00 Mar. 18, 2009 Page 163 of 980
Bus cycle
T
2
Section 6 Bus Controller (BSC)
T
3
REJ09B0050-0600

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