DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 255

MCU 3V 384K 128-QFP

DF2367VF33

Manufacturer Part Number
DF2367VF33
Description
MCU 3V 384K 128-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2367VF33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
84
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2367VF33
HD64F2367VF33

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Relationship between Chip Select (CS) Signal and Read (RD) Signal: Depending on the
system’s load conditions, the RD signal may lag behind the CS signal. An example is shown in
figure 6.47. In this case, with the setting for no idle cycle insertion (a), there may be a period of
overlap between the bus cycle A RD signal and the bus cycle B CS signal. Setting idle cycle
insertion, as in (b), however, will prevent any overlap between the RD and CS signals. In the
initial state after reset release, idle cycle insertion (b) is set.
Address bus
CS (area A)
CS (area B)
HWR, LWR
Data bus
Figure 6.46 Example of Idle Cycle Operation (Read after Write)
RD
φ
(a) No idle cycle insertion
T
(ICIS2 = 0)
1
Bus cycle A
Long output floating time
T
2
T
3
Bus cycle B
T
1
T
2
Data collision
Address bus
CS (area A)
CS (area B)
Data bus
HWR
RD
φ
Rev.6.00 Mar. 18, 2009 Page 195 of 980
T
(b) Idle cycle insertion
1
Bus cycle A
(ICIS2 = 1, initial value)
Section 6 Bus Controller (BSC)
T
2
T
3
Idle cycle
T
i
Bus cycle B
REJ09B0050-0600
T
1
T
2

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