DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 260

MCU 3V 384K 128-QFP

DF2367VF33

Manufacturer Part Number
DF2367VF33
Description
MCU 3V 384K 128-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2367VF33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
84
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2367VF33
HD64F2367VF33

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Manufacturer
Quantity
Price
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Manufacturer:
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Section 6 Bus Controller (BSC)
• Normal space access after DRAM space write access
Rev.6.00 Mar. 18, 2009 Page 200 of 980
REJ09B0050-0600
While the ICIS2 bit is set to 1 in BCR and a normal space read access occurs after DRAM
space write access, idle cycle is inserted in the first read cycle. The number of states of the idle
cycle to be inserted is in accordance with the setting of the IDLC bit. It does not depend on the
DRMI bit in DRACCR. Figure 6.53 shows an example of idle cycle operation when the ICIS2
bit is set to 1.
UCAS, LCAS
Address bus
Figure 6.53 Example of Idle Cycle Operation after DRAM Write Access
HWR, LWR
Data bus
RAS
RD
φ
(IDLC = 0, ICIS1 = 0, RAST = 0, CAST = 0)
T
p
DRAM space read
T
r
T
c1
T
c2
Idle cycle
T
i
External space read
T
1
T
2
T
3
DRAM space read
T
c1
T
c2

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