DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 954

MCU 3V 384K 128-QFP

DF2367VF33

Manufacturer Part Number
DF2367VF33
Description
MCU 3V 384K 128-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2367VF33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
84
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2367VF33
HD64F2367VF33

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2367VF33V
Manufacturer:
Renesas Electronics America
Quantity:
135
Part Number:
DF2367VF33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
DF2367VF33WV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 894 of 980
REJ09B0050-0600
Read
Write
Notes:
DACK0, DACK1
φ
A23 to A0
RAS3, RAS2
UCAS, LCAS
OE, RD
HWR
D15 to D0
UCAS, LCAS
OE, RD
HWR
D15 to D0
AS
WAIT
Tcw :
Tcwp:
DACK timing: when DDS = 0
RAS timing: when RAST = 0
Figure 25.14 DRAM Access Timing: Two-State Access, One Wait
Wait cycle inserted by programmable wait function
Wait cycle inserted by pin wait function
T
p
T
r
T
c1
t
WTS
T
cw
t
WTH
t
WTS
T
cwp
t
WTH
T
c2

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