DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 773

MCU 3V 384K 128-QFP

DF2367VF33

Manufacturer Part Number
DF2367VF33
Description
MCU 3V 384K 128-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2367VF33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
84
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2367VF33
HD64F2367VF33

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Part Number
Manufacturer
Quantity
Price
Part Number:
DF2367VF33V
Manufacturer:
Renesas Electronics America
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135
Part Number:
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Manufacturer:
Renesas Electronics America
Quantity:
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Part Number:
DF2367VF33WV
Manufacturer:
Renesas Electronics America
Quantity:
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8. Do not touch the socket adapter or chip during programming.
9. Apply the reset signal after the SWE, bit is cleared during its operation.
Touching either of these can cause contact faults and write errors.
The reset signal is applied at least 100 µs after the SWE bit has been cleared.
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
Rev.6.00 Mar. 18, 2009 Page 713 of 980
REJ09B0050-0600

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