DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 1034

MCU 3V 384K 128-QFP

DF2367VF33

Manufacturer Part Number
DF2367VF33
Description
MCU 3V 384K 128-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2367VF33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
84
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2367VF33
HD64F2367VF33

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Manufacturer:
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Appendix
Notes: 1. EAs is the ER5 value and EAd the ER6 value. 1 is added to each of them after
Rev.6.00 Mar. 18, 2009 Page 974 of 980
REJ09B0050-0600
Instruction
XOR.L
ERs,ERd
XORC
#xx:8,CCR
XORC
#xx:8,EXR
Reset
exception
handling
Interrupt
exception
handling
2. Repeated two times when two registers are stored/retrieved, three times when three
3. Start address on returning.
4. Start address of program.
5. Prefetch address that is obtained by adding 2 to the saved PC.
6. Start address of interrupt handling routine.
7. Registers ER0, ER1, ER4, and ER5 are used for a TAS instruction.
8. Registers ER0 to ER6 are used for an STM/LDM instruction.
Advanced
Advanced
execution.
n is the initial value of R4L or R4, and the processing is not executed when n = 0.
registers are stored/retrieved, and four times when four registers are stored/retrieved.
Reading is not performed on returning from sleep mode or software standby mode, and
this is regarded as internal operation.
1
R:W 2nd R:W
R:W
NEXT
R:W 2nd R:W
R:W:M
VEC
R:W *
5
2
NEXT
NEXT
R:W
VEC+2
1 state of
internal
operation
3
1 state of
internal
operation
W:W
Stack (L)
4
R:W *
W:W
Stack
(H)
4
5
W:W
Stack
(EXR)
6
R:W:M
VEC
7
R:W
VEC+2
8
1 state of
internal
operation
9
R:W *
6

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