DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 828

MCU 3V 384K 128-QFP

DF2367VF33

Manufacturer Part Number
DF2367VF33
Description
MCU 3V 384K 128-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2367VF33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
84
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2367VF33
HD64F2367VF33

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Section 20 Flash Memory (0.18-μm F-ZTAT Version)
The area that can be executed in the steps of the user procedure program (on-chip RAM, user
MAT, and external space) is shown in section 20.4.4, Procedure Program and Storable Area for
Programming Data.
20.4.4
In the descriptions in the previous section, the programming/erasing procedure programs and
storable areas for program data are assumed to be in the on-chip RAM. However, the program and
the data can be stored in and executed from other areas, such as part of flash memory which is not
to be programmed or erased, or somewhere in the external address space.
(1)
1. The on-chip programming/erasing program is downloaded from the address in the on-chip
2. The on-chip programming/erasing program will use the 128 bytes as a stack. So, make sure
3. Download by setting the SCO bit to 1 will lead to switching of the MAT. If, therefore, this
4. The flash memory is accessible until the start of programming or erasing, that is, until the
5. The flash memory is not accessible during programming/erasing operations, therefore, the
6. After programming/erasing, the flash memory should be inhibited until FKEY is cleared.
7. Switching of the MATs by FMATS should be needed when programming/erasing of the user
Rev.6.00 Mar. 18, 2009 Page 768 of 980
REJ09B0050-0600
RAM specified by FTDAR, therefore, this area is not available for use.
that this area is secured.
operation is used, it should be executed from the on-chip RAM.
result of downloading has been determined. When in a mode in which the external address
space is not accessible, such as single-chip mode, the required procedure programs, NMI
handling vector and NMI handler should be transferred to the on-chip RAM before
programming/erasing of the flash memory starts.
operation program is downloaded to the on-chip RAM to be executed. The NMI-handling
vector and programs such as that which activate the operation program, and NMI handler
should thus be stored in on-chip memory other than flash memory or the external address
space.
The reset state (RES = 0) must be in place for more than 100 μs when the LSI mode is changed
to reset on completion of a programming/erasing operation.
Transitions to the reset state, and hardware standby mode are inhibited during
programming/erasing. When the reset signal is accidentally input to the chip, a longer period in
the reset state than usual (100 μs) is needed before the reset signal is released.
boot MAT is operated in user-boot mode. The program which switches the MATs should be
executed from the on-chip RAM. See section 20.6, Switching between User MAT and User
Boot MAT. Please make sure you know which MAT is selected when switching between
them.
Conditions that Apply to Programming/Erasing
Procedure Program and Storable Area for Programming Data

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