DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 925

MCU 3V 384K 128-QFP

DF2367VF33

Manufacturer Part Number

DF2367VF33

Description

MCU 3V 384K 128-QFP

Manufacturer

Renesas Electronics America

Series

H8® H8S/2300r

Datasheet

1.DF2368VTE34V.pdf (1044 pages)

Specifications of DF2367VF33

Core Processor

H8S/2000

Core Size

16-Bit

Speed

33MHz

Connectivity

I²C, IrDA, SCI, SmartCard

Peripherals

DMA, POR, PWM, WDT

Number Of I /o

84

Program Memory Size

384KB (384K x 8)

Program Memory Type

FLASH

Ram Size

24K x 8

Voltage - Supply (vcc/vdd)

3 V ~ 3.6 V

Data Converters

A/D 10x10b, D/A 2x8b

Oscillator Type

Internal

Operating Temperature

-20°C ~ 75°C

Package / Case

128-QFP

Lead Free Status / RoHS Status

Contains lead / RoHS non-compliant

Eeprom Size

-

Other names

HD64F2367VF33
HD64F2367VF33

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Bonase Electronics (HK) Co., Limited

Part Number:

DF2367VF33V

Manufacturer:

Renesas Electronics America

Quantity:

135

Company:

BOSTOCK HK LIMITED

BOSTOCK HK LIMITED

Part Number:

DF2367VF33V

Manufacturer:

Renesas Electronics America

Quantity:

10 000

Company:

BOSTOCK HK LIMITED

BOSTOCK HK LIMITED

Part Number:

DF2367VF33WV

Manufacturer:

Renesas Electronics America

Quantity:

10 000

Current page: 925 of 1044
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Register

Name

TCR_4

TMDR_4

TIOR_4

TIER_4

TSR_4

SMR_3

BRR_3

SCR_3

TDR_3

SSR_3

RDR_3

SCMR_3

SMR_4

BRR_4

SCR_4

TDR_4

SSR_4

RDR_4

SCMR_4

TCR_3

TMDR_3

TIORH_3

TIORL_3

TIER_3

TSR_3

TCNT_3

TGRA_3

TGRB_3

TGRC_3

TGRD_3

Reset

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High-

Speed

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Clock

Division Sleep

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Rev.6.00 Mar. 18, 2009 Page 865 of 980

All Module

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Section 24 List of Registers

Software

Standby

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Initialized Initialized

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Hardware

Standby

Initialized

Initialized

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REJ09B0050-0600

Module

TPU_4

SCI_3

SCI_4

TPU_3

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