DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 252

MCU 3V 384K 128-QFP

DF2367VF33

Manufacturer Part Number
DF2367VF33
Description
MCU 3V 384K 128-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2367VF33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
84
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2367VF33
HD64F2367VF33

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Part Number
Manufacturer
Quantity
Price
Part Number:
DF2367VF33V
Manufacturer:
Renesas Electronics America
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Part Number:
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Manufacturer:
Renesas Electronics America
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Part Number:
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Section 6 Bus Controller (BSC)
6.7.2
As with the basic bus interface, either program wait insertion or pin wait insertion using the WAIT
pin can be used in the initial cycle (full access) on the burst ROM interface. See section 6.5.4,
Wait Control. Wait states cannot be inserted in a burst cycle.
6.7.3
When a write access to burst ROM space is executed, burst access is interrupted at that point and
the write access is executed in line with the basic bus interface settings. Write accesses are not
performed in burst mode even though burst ROM space is designated.
Rev.6.00 Mar. 18, 2009 Page 192 of 980
REJ09B0050-0600
Wait Control
Write Access
Upper address bus
Lower address bus
Figure 6.43 Example of Burst ROM Access Timing
Note: n = 1, 0
Data bus
CSn
RD
AS
(ASTn = 0, 1-State Burst Cycle)
φ
T
1
Full access
T
2
T
Burst access
1
T
1

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