C8051F302 Silicon Laboratories Inc, C8051F302 Datasheet - Page 93

• Manufacturer Part Number: C8051F302
• Description: IC 8051 MCU 8K FLASH 11MLP
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F30xr

Specifications of C8051F302

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: SMBus (2-Wire/I²C), UART/USART
• Peripherals: POR, PWM, Temp Sensor, WDT
• Number Of I /o: 8
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 11-VQFN
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: I2C, SMBus, UART
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 8
• Number Of Timers: 16 bit
• Operating Supply Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No

11.4.
If a crystal or ceramic resonator is used as an external oscillator source for the MCU, the circuit should be configured
as shown in Figure 11.1, Option 1. The External Oscillator Frequency Control value (XFCN) should be chosen from
the Crystal colum of the table in Figure 11.4 (OSCXCN register). For example, an 11.0592 MHz crystal requires an
XFCN setting of 111b.
When the crystal oscillator is first enabled, the oscillator amplitude detection circuit requires a settling time to
achieve proper bias. Introducing a delay of 1 ms between enabling the oscillator and checking the XTLVLD bit will
prevent a premature switch to the external oscillator as the system clock. Switching to the external oscillator before
the crystal oscillator has stabilized can result in unpredictable behavior. The recommended procedure is:
Important Note on External Crystals: Crystal oscillator circuits are quite sensitive to PCB layout. The crystal
should be placed as close as possible to the XTAL pins on the device. The traces should be as short as possible and
shielded with ground plane from any other traces which could introduce noise or interference.
11.5.
If an RC network is used as an external oscillator source for the MCU, the circuit should be configured as shown in
Figure 11.1, Option 2. The capacitor should be no greater than 100 pF; however for very small capacitors, the total
capacitance may be dominated by parasitic capacitance in the PCB layout. To determine the required External Oscil-
lator Frequency Control value (XFCN) in the OSCXCN Register, first select the RC network value to produce the
desired frequency of oscillation. If the frequency desired is 100 kHz, let R = 246 kΩ and C = 50 pF:
f = 1.23( 10
Referring to the table in Figure 11.4, the required XFCN setting is 010b.
11.6.
If a capacitor is used as an external oscillator for the MCU, the circuit should be configured as shown in Figure 11.1,
Option 3. The capacitor should be no greater than 100 pF; however for very small capacitors, the total capacitance
may be dominated by parasitic capacitance in the PCB layout. To determine the required External Oscillator Fre-
quency Control value (XFCN) in the OSCXCN Register, select the capacitor to be used and find the frequency of
oscillation from the equations below. Assume VDD = 3.0 V and C = 50 pF:
f = KF / ( C * VDD ) = KF / ( 50 * 3 ) MHz
f = KF / 150 MHz
If a frequency of roughly 150 kHz is desired, select the K Factor from the table in Figure 11.4 as KF = 22:
f = 22 / 150 = 0.146 MHz, or 146 kHz
Therefore, the XFCN value to use in this example is 011b.
External Crystal Example
Step 1. Enable the external oscillator.
Step 2. Wait at least 1 ms.
Step 3. Poll for XTLVLD => ‘1’.
Step 4. Switch the system clock to the external oscillator.
External RC Example
External Capacitor Example
3
) / RC = 1.23 ( 10
3
) / [ 246 * 50 ] = 0.1 MHz = 100 kHz
Rev. 2.3
C8051F300/1/2/3/4/5
93