NNDK-MOD5272-KIT NetBurner Inc, NNDK-MOD5272-KIT Datasheet - Page 494
NNDK-MOD5272-KIT
Manufacturer Part Number
NNDK-MOD5272-KIT
Description
KIT DEVELOP NETWORK FOR MOD5272
Manufacturer
NetBurner Inc
Series
ColdFire®r
Datasheets
1.MOD5272-100IR.pdf
(2 pages)
2.MOD5272-100IR.pdf
(550 pages)
3.NNDK-MOD5282-KIT.pdf
(2 pages)
Specifications of NNDK-MOD5272-KIT
Main Purpose
*
Embedded
*
Utilized Ic / Part
MOD5272
Primary Attributes
*
Secondary Attributes
*
Processor To Be Evaluated
MOD5272
Interface Type
RS-232, RS-485, USB
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Contains lead / RoHS non-compliant
Other names
528-1001
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Package Dimensions
22.2 Package Dimensions
Figure 22-2 shows MCF5272 package dimensions.
22-2
13X
3
e
X
E
Y
b
0.30
0.10 Z
S
0.20
Figure 22-2. 196 MAPBGA Package Dimensions (Case No. 1128A-01)
Z
14 13 12 11
X
Y
Laser mark for pin 1
identification in
this area
10
9
View M-m
D
6
13X
S
5
e
4
3
MCF5272 User’s Manual
2
1
M
A
B
C
D
E
G
H
K
N
P
F
J
L
Metalized mark for
pin 1 identification
in this area
K
M
M
A
A2
A1
Rotated 90 Clockwise
NOTES:
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances
3. Dimension B is measured at the
4. Datum Z (seating plane) is defined
5. Parallelism measurement shall
per ASME Y14.5M, 1994.
maximum solder ball diameter,
parallel to datum plane Z.
by the spherical crowns of the solder
balls.
exclude any effect of mark on top
surface of package.
Z
DIM Min
A1 0.27 0.47
A2
Detail K
A
D
b
E
e
S
°
4
1.32 1.75
0.35 0.65
15.00 BSC
15.00 BSC
Millimeters
1.18 REF
1.00 BSC
0.50 BSC
Max
0.15 Z
MOTOROLA
5
0.30 Z
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