D12312SVTE25 Renesas Electronics America, D12312SVTE25 Datasheet - Page 1054

MCU 3V 0K 100-TQFP

D12312SVTE25

Manufacturer Part Number
D12312SVTE25
Description
MCU 3V 0K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of D12312SVTE25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412312SVTE25
HD6412312SVTE25

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12312SVTE25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Appendix B Internal I/O Registers
RDR0—Receive Data Register 0
SCMR0—Smart Card Mode Register 0
Bit
Initial value
Read/Write
Rev.7.00 Feb. 14, 2007 page 1020 of 1108
REJ09B0089-0700
Bit
Initial value
Read/Write
:
:
:
:
:
:
7
1
R
7
0
6
1
R
6
0
5
1
Smart Card Data Direction
R
5
0
0
1
4
1
Stores received serial data
TDR contents are transmitted LSB-first
Receive data is stored in RDR LSB-first
TDR contents are transmitted MSB-first
Receive data is stored in RDR MSB-first
SDIR
R/W
3
0
R
H'FF7D
H'FF7E
4
0
Smart Card Data Invert
0
1
SINV
R/W
2
0
TDR contents are transmitted as they are
Receive data is stored in RDR as it is
TDR contents are inverted before
being transmitted
Receive data is stored in RDR
in inverted form
R
3
0
Smart Card
Interface Mode Select
0
1
Smart card interface
function is disabled
Smart card interface
function is enabled
SCI0, Smart Card Interface 0
SCI0, Smart Card Interface 0
1
1
R
2
0
SMIF
R/W
0
0
R
1
0
R
0
0

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