D12312SVTE25 Renesas Electronics America, D12312SVTE25 Datasheet - Page 825

• Manufacturer Part Number: D12312SVTE25
• Description: MCU 3V 0K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of D12312SVTE25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Type: ROMless
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -
• Other names: HD6412312SVTE25; HD6412312SVTE25

Table 17.73 (3) Usable Area for Programming in User Boot Mode
Notes: 1. Transferring the data to the on-chip RAM enables this area to be used.
Storage Area for Program
Data
Operation for Selection of
On-Chip Program to be
Downloaded
Operation for Writing H'A5
to Key Register
Execution of Writing SC0 =
1 to FCCS (Download)
Operation for Key Register
Clear
Judgement of Download
Result
Operation for Download
Error
Operation for Settings of
Default Parameter
Execution of Initialization
Judgement of Initialization
Result
Operation for Initialization
Error
Operation for Interrupt
Inhibit
Switching MATs by
FMATS
Operation for Writing H'5A
to Key Register
Operation for Settings of
Program Parameter
Execution of Programming
Judgement of Program
Result
Operation for Program
Error
Operation for Key Register
Clear
Switching MATs by
FMATS
2. Switching FMATS by a program in the on-chip RAM enables this area to be used.
Item
On-Chip
RAM
Storable/Executable Area
Boot
User
MAT
× *
× *
×
×
×
×
×
×
×
×
×
1
2
External Space
(Expanded
Mode)
Rev.7.00 Feb. 14, 2007 page 791 of 1108
×
×
×
×
×
User
MAT
—
Selected MAT
Boot
User
MAT
—
REJ09B0089-0700
Section 17 ROM
Storage Area
Embedded
Program
—