D12312SVTE25 Renesas Electronics America, D12312SVTE25 Datasheet - Page 16

• Manufacturer Part Number: D12312SVTE25
• Description: MCU 3V 0K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of D12312SVTE25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Type: ROMless
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -
• Other names: HD6412312SVTE25; HD6412312SVTE25

Item
20.3.6 Flash Memory
Characteristics
Table 20.29 Flash
Memory
Characteristics
Appendix E Products
Lineup
Table E.1 H8S/2319
Group Products Lineup
F. Package
Dimensions
Figure F.4 TLP-113V
Package Dimensions
All trademarks and registered trademarks are the property of their respective owners.
Rev.7.00 Feb. 14, 2007 page xiv of xxxii
REJ09B0089-0700
Page
860
1103
1104
Revision (See Manual for Details)
Table 20.29 amended
Note 5 added
Note: 5. Reference value for 25°C (as a guideline, rewriting
should normally function up to this value).
Table E.1 amended
HD64F2319E*
H8S/2317(S)*
Notes amended
Notes: 1. The on-chip debug function can be used with the
E10A emulator (E10A compatible version).
2. H8S/2317S in mask ROM version.
Figure F.4 replaced
Item
Number of overwrites
Data retention time *
4
2
1
Symbol
t
NWEC
DRP
Min
100 *
10
3
Typ
10000 *
—
5
Max
—
—
Times
Unit
Years
Test Conditions