D12312SVTE25 Renesas Electronics America, D12312SVTE25 Datasheet - Page 623

MCU 3V 0K 100-TQFP

D12312SVTE25

Manufacturer Part Number
D12312SVTE25
Description
MCU 3V 0K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of D12312SVTE25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412312SVTE25
HD6412312SVTE25

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12312SVTE25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
17.6
When pins are set to on-board programming mode, program/erase/verify operations can be
performed on the on-chip flash memory. There are two on-board programming modes: boot mode
and user program mode. The pin settings for transition to each of these modes are shown in table
17.9. For a diagram of the transitions to the various flash memory modes, see figure 17.3.
Table 17.9 Setting On-Board Programming Modes
MCU Mode
Boot mode
User program mode *
Note: * Normally, user mode should be used. Set the FWE pin to 1 to make a transition to user
program mode before performing a program/erase/verify operation.
On-Board Programming Modes
CPU Operating Mode
Advanced expanded mode with
on-chip ROM enabled
Advanced single-chip mode
Advanced expanded mode with
on-chip ROM enabled
Advanced single-chip mode
Modes
Rev.7.00 Feb. 14, 2007 page 589 of 1108
FWE
1
1
MD2
0
1
Pins
REJ09B0089-0700
MD1
1
1
Section 17 ROM
MD0
0
1
0
1

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