D12312SVTE25 Renesas Electronics America, D12312SVTE25 Datasheet - Page 669

MCU 3V 0K 100-TQFP

D12312SVTE25

Manufacturer Part Number
D12312SVTE25
Description
MCU 3V 0K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of D12312SVTE25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412312SVTE25
HD6412312SVTE25

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12312SVTE25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Writing Overlap RAM Data in User Program Mode: When overlap RAM data is confirmed,
the RAMS bit is cleared, RAM overlap is released, and writes should actually be performed to the
flash memory.
When the programming control program is transferred to RAM, ensure that the transfer destination
and the overlap RAM do not overlap, as this will cause data in the overlap RAM to be rewritten.
17.13.6 Differences between Boot Mode and User Program Mode
Table 17.25 Differences between Boot Mode and User Program Mode
Entire memory erase
Block erase
Programming control program *
Note: * To be provided by the user, in accordance with the recommended algorithm.
Figure 17.38 Writing Overlap RAM Data in User Program Mode
Application program
Programming data
Flash memory
Boot Mode
Yes
No
Program/program-verify
Rev.7.00 Feb. 14, 2007 page 635 of 1108
Programming control
(programming data)
Execution state
User Program Mode
Yes
Erase/erase-verify/program/
program-verify/emulation
Yes
Overlap RAM
program
RAM
SCI
REJ09B0089-0700
Section 17 ROM

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