D12312SVTE25 Renesas Electronics America, D12312SVTE25 Datasheet - Page 714

MCU 3V 0K 100-TQFP

D12312SVTE25

Manufacturer Part Number
D12312SVTE25
Description
MCU 3V 0K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of D12312SVTE25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412312SVTE25
HD6412312SVTE25

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12312SVTE25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 17 ROM
17.20.7 Status Read Mode
• Status read mode is used to identify what type of abnormal end has occurred. Use this mode
• The return code is retained until a command write for other than status read mode is
Table 17.42 AC Characteristics in Status Read Mode
Conditions: V
Item
Command write cycle
CE hold time
CE setup time
Data hold time
Data setup time
Write pulse width
OE output delay time
Disable delay time
CE output delay time
WE rise time
WE fall time
Rev.7.00 Feb. 14, 2007 page 680 of 1108
REJ09B0089-0700
when an abnormal end occurs in auto-program mode or auto-erase mode.
performed.
I/O
A
5
18
to I/O
to A
I/O
I/O
WE
OE
CE
CC
0
7
6
0
= 3.3 V ±0.3 V, V
Figure 17.57 Auto-Erase Mode Timing Waveforms
t
ces
t
f
t
ds
t
wep
Symbol
t
t
t
t
t
t
t
t
t
t
t
H'20
nxtc
ceh
ces
dh
ds
wep
oe
df
ce
r
f
SS
t
ceh
t
r
= 0 V, T
t
dh
t
nxtc
a
= 25°C ±5°C
H'20
Min
20
0
0
50
50
70
Erase end identifi-
cation signal
Erase normal end
confirmation signal
t
ests
t
erase
t
spa
Max
150
100
150
30
30
H'00
t
nxtc
Unit
μs
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns

Related parts for D12312SVTE25