D12312SVTE25 Renesas Electronics America, D12312SVTE25 Datasheet - Page 824

MCU 3V 0K 100-TQFP

D12312SVTE25

Manufacturer Part Number
D12312SVTE25
Description
MCU 3V 0K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of D12312SVTE25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412312SVTE25
HD6412312SVTE25

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12312SVTE25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 17 ROM
Table 17.73 (2) Usable Area for Erasure in User Program Mode
Rev.7.00 Feb. 14, 2007 page 790 of 1108
REJ09B0089-0700
Operation for Selection of
On-Chip Program to be
Downloaded
Operation for Writing H'A5
to Key Register
Execution of Writing SC0 =
1 to FCCS (Download)
Operation for Key Register
Clear
Judgement of Download
Result
Operation for Download
Error
Operation for Settings of
Default Parameter
Execution of Initialization
Judgement of Initialization
Result
Operation for Initialization
Error
Operation for Inhibit of
Interrupt
Operation for Writing H'5A
to Key Register
Operation for Settings of
Erasure Parameter
Execution of Erasure
Judgement of Erasure
Result
Operation for Erasure
Error
Operation for Key Register
Clear
Item
On-Chip
RAM
Storable/Executable Area
User
MAT
×
×
×
×
×
×
×
External Space
(Expanded
Mode)
×
×
×
User
MAT
Selected MAT
Storage Area
Embedded
Program

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