DF70844AD80FPV Renesas Electronics America, DF70844AD80FPV Datasheet - Page 28

IC SUPERH MCU FLASH 112LQFP

DF70844AD80FPV

Manufacturer Part Number
DF70844AD80FPV
Description
IC SUPERH MCU FLASH 112LQFP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7080r
Datasheet

Specifications of DF70844AD80FPV

Core Size
32-Bit
Program Memory Size
256KB (256K x 8)
Core Processor
SH-2
Speed
80MHz
Connectivity
EBI/EMI, FIFO, I²C, SCI, SSU
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
112-LQFP
No. Of I/o's
76
Ram Memory Size
16KB
Cpu Speed
80MHz
Digital Ic Case Style
LQFP
Supply Voltage Range
3V To 3.6V, 4.5V To 5.5V
Embedded Interface Type
I2C, SCI
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
R0K570865S001BE - KIT STARTER FOR SH7086R0K570865S000BE - KIT STARTER FOR SH7086HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF70844AD80FPV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Company:
Part Number:
DF70844AD80FPV
Quantity:
5 000
Section 6 Interrupt Controller (INTC)
Figure 6.1 Block Diagram of INTC............................................................................................ 106
Figure 6.2 Block Diagram of IRQ7 to IRQ0 Interrupts Control................................................. 122
Figure 6.3 Interrupt Sequence Flowchart ................................................................................... 129
Figure 6.4 Stack after Interrupt Exception Handling.................................................................. 130
Figure 6.5 IRQ Interrupt Control Block Diagram ...................................................................... 132
Figure 6.6 On-Chip Module Interrupt Control Block Diagram .................................................. 133
Section 7 User Break Controller (UBC)
Figure 7.1 Block Diagram of UBC............................................................................................. 136
Section 8 Data Transfer Controller (DTC)
Figure 8.1 Block Diagram of DTC ............................................................................................. 172
Figure 8.2 Transfer Information on Data Area ........................................................................... 185
Figure 8.3 Correspondence between DTC Vector Address and Transfer Information............... 185
Figure 8.4 Flowchart of DTC Operation .................................................................................... 190
Figure 8.5 Transfer Information Read Skip Timing
Figure 8.6 Memory Map in Normal Transfer Mode................................................................... 196
Figure 8.7 Memory Map in Repeat Transfer Mode
Figure 8.8 Memory Map in Block Transfer Mode
Figure 8.9 Operation of Chain Transfer...................................................................................... 200
Figure 8.10 Example of DTC Operation Timing:
Figure 8.11 Example of DTC Operation Timing: Block Transfer Mode with Block Size = 2
Figure 8.12 Example of DTC Operation Timing: Chain Transfer
Rev. 3.00 May 17, 2007 Page xxviii of Iviii
(Activated by On-Chip Peripheral Module; Iφ: Bφ: Pφ =1: 1/2: 1/2;
Data Transferred from On-Chip Peripheral Module to On-Chip RAM;
Transfer Information is Written in 3 States).............................................................. 194
(When Transfer Source is Specified as Repeat Area)................................................ 197
(When Transfer Destination is Specified as Block Area).......................................... 199
Normal Transfer Mode or Repeat Transfer Mode
(Activated by On-Chip Peripheral Module; Iφ: Bφ: Pφ =1: 1/2: 1/2;
Data Transferred from On-Chip Peripheral Module to On-Chip RAM;
Transfer Information is Written in 3 Cycles) .......................................................... 201
(Activated by On-Chip Peripheral Module; Iφ: Bφ: Pφ =1: 1/2: 1/2;
Data Transferred from On-Chip Peripheral Module to On-Chip RAM;
Transfer Information is Written in 3 Cycles) .......................................................... 201
(Activated by On-Chip Peripheral Module; Iφ: Bφ: Pφ =1: 1/2: 1/2;
Data Transferred from On-Chip Peripheral Module to On-Chip RAM;
Transfer Information is Written in 3 Cycles) .......................................................... 202

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