SI4010-C2-GT Silicon Laboratories Inc, SI4010-C2-GT Datasheet - Page 25

• Manufacturer Part Number: SI4010-C2-GT
• Description: IC TX 27-960MHZ FSK 3.6V 10MSOP
• Manufacturer: Silicon Laboratories Inc
• Series: EZRadio®r
• Type: Crystalless SoC RF Transmitterr

Specifications of SI4010-C2-GT

• Package / Case: 10-MSOP
• Mfg Application Notes: SI4010 Calculator Spreadsheet AppNote
• Frequency: 27MHz ~ 960MHz
• Applications: Garage Openers, RKE, Security Alarms
• Modulation Or Protocol: FSK, OOK
• Data Rate - Maximum: 100 kBaud
• Power - Output: 10dBm
• Current - Transmitting: 19.8mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Memory Size: 4kB RAM
• Features: 8051 MCU Core, Crystal-less Operation
• Voltage - Supply: 1.8 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Operating Frequency: 27 MHz to 960 MHz
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Operating Supply Voltage: 1.8 V to 3.6 V
• Supply Current: 14.2 mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 336-1997-5

Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ASME Y14.5M-1994.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC).
1. All metal pads are to be non-solder mask defined (NSMD). Clearance
1. A stainless steel, laser-cut and electro-polished stencil with
2. The stencil thickness should be 0.125mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1.
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-
Dimension
Least Material Condition (LMC) is calculated based on a Fabrication
Allowance of 0.05mm.
between the solder mask and the metal pad is to be 60 m minimum, all
the way around the pad.
trapezoidal walls should be used to assure good solder paste release.
020 specification for Small Body Components.
G1
C1
X1
Y1
Z1
E
Table 8.1. 10-Pin MSOP Dimensions
Rev. 1.0
3.00
MIN
—
—
4.40 REF
0.50 BSC
1.40 REF
MAX
0.30
5.80
—
Si4010-C2
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