HD64F3048VTF8 Renesas Electronics America, HD64F3048VTF8 Datasheet - Page 732

• Manufacturer Part Number: HD64F3048VTF8
• Description: IC H8 MCU FLASH 128K 100-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3048VTF8

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 8MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F3048VX8

Section 22 Electrical Characteristics
Table 22.16 Control Signal Timing
Condition A: V
Condition C: V
Item
RES setup time
RES pulse width
Mode programming setup time
RESO output delay time
RESO output pulse width
NMI setup time
(NMI, IRQ
NMI hold time
(NMI, IRQ
Interrupt pulse width
(NMI, IRQ
when exiting software
standby mode)
Clock oscillator settling
time at reset (crystal)
Clock oscillator settling
time in software standby
(crystal)
Rev. 7.00 Sep 21, 2005 page 706 of 878
REJ09B0259-0700
5
5
2
to IRQ
to IRQ
to IRQ
V
specifications), T
V
specifications), T
0
0
0
)
)
CC
SS
CC
SS
= AV
= AV
= 2.7 V to 5.5 V, AV
= 5.0 V ± 10%, AV
SS
SS
= 0 V, = 1 MHz to 8 MHz, T
= 0 V, = 1 MHz to 16 MHz, T
Symbol
t
t
t
t
t
t
t
t
t
t
RESS
RESW
MDS
RESD
RESOW
NMIS
NMIH
NMIW
OSC1
OSC2
a
a
= –40°C to +85°C (wide-range specifications)
= –40°C to +85°C (wide-range specifications)
CC
CC
= 5.0 V ± 10%, V
Min
200
10
200
—
132
200
10
200
20
7
= 2.7 V to 5.5 V, V
Condition A
8 MHz
Max
—
—
—
100
—
—
—
—
—
—
a
= –20°C to +75°C (regular
a
REF
= –20°C to +75°C (regular
Min
200
10
200
—
132
150
10
200
20
7
REF
= 4.5 V to AV
Condition C
= 2.7 V to AV
16 MHz
Max
—
—
—
100
—
—
—
—
—
—
CC
Unit
ns
t
ns
ns
t
ns
ms
ms
,
CYC
CYC
CC
,
Test
Conditions
Figure 22.18
Figure 22.19
Figure 22.20
Figure 22.22
Figure 21.1