D12363VTE33 Renesas Electronics America, D12363VTE33 Datasheet - Page 249

MCU 3V 0K 120-TQFP

D12363VTE33

Manufacturer Part Number
D12363VTE33
Description
MCU 3V 0K 120-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of D12363VTE33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
84
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
120-TQFP, 120-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412363VTE33
HD6412363VTE33

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12363VTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
When DDS = 0 : When DRAM space is accessed in DMAC single address transfer mode, full
access (normal access) is always performed. With the DRAM interface, the DACK output goes
low from the T
In modes other than DMAC single address transfer mode, burst access can be used when
accessing DRAM space.
Figure 6.41 shows the DACK output timing for the DRAM interface when DDS = 0.
Read
Write
Note: n = 2, 3
Figure 6.41 Example of DACK Output Timing when DDS = 0 (RAST = 0, CAST = 1)
φ
Address bus
RASn (CSn)
UCAS, LCAS
WE (HWR)
OE (RD)
Data bus
WE (HWR)
OE (RD)
Data bus
DACK
r
state.
T
p
Row address
High
High
T
r
T
Rev.6.00 Mar. 18, 2009 Page 189 of 980
c1
Column address
Section 6 Bus Controller (BSC)
T
c2
REJ09B0050-0600
T
c3

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