D12363VTE33 Renesas Electronics America, D12363VTE33 Datasheet - Page 341

MCU 3V 0K 120-TQFP

D12363VTE33

Manufacturer Part Number
D12363VTE33
Description
MCU 3V 0K 120-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of D12363VTE33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
84
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
120-TQFP, 120-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412363VTE33
HD6412363VTE33

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12363VTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
When the DREQ pin low level is sampled while acceptance by means of the DREQ pin is
possible, the request is held in the DMAC. Then, when activation is initiated in the DMAC, the
request is cleared. After the end of the single cycle, acceptance resumes, DREQ pin low level
sampling is performed again, and this operation is repeated until the transfer ends.
7.5.11
DMAC internal-to-external dual address transfers and single address transfers can be executed at
high speed using the write data buffer function, enabling system throughput to be improved.
When the WDBE bit of BCR in the bus controller is set to 1, enabling the write data buffer
function, external write cycles in dual address transfers or single address transfers are executed in
parallel with internal accesses (on-chip memory or internal I/O registers). Internal accesses are
independent of the bus master, and DMAC dead cycles are regarded as internal accesses.
A low level can always be output from the TEND pin if the bus cycle in which a low level is to be
output from the TEND pin is an external bus cycle. However, a low level is not output from the
TEND pin if the bus cycle in which a low level is to be output from the TEND pin is an internal
bus cycle, and an external write cycle is executed in parallel with this cycle.
Figure 7.32 shows an example of dual address transfer using the write data buffer function. In this
example, burst mode transfer from on-chip RAM to external memory is performed.
Figure 7.32 Example of Dual Address Transfer Using Write Data Buffer Function
Internal read signal
External address
Internal address
Write Data Buffer Function
HWR, LWR
TEND
φ
DMA
read
DMA
write
DMA
read
DMA
write
DMA
read
Rev.6.00 Mar. 18, 2009 Page 281 of 980
Section 7 DMA Controller (DMAC)
DMA
write
DMA
read
DMA
write
REJ09B0050-0600
DMA
dead

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