D12363VTE33 Renesas Electronics America, D12363VTE33 Datasheet - Page 778

MCU 3V 0K 120-TQFP

D12363VTE33

Manufacturer Part Number
D12363VTE33
Description
MCU 3V 0K 120-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of D12363VTE33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
84
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
120-TQFP, 120-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412363VTE33
HD6412363VTE33

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12363VTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
• Three on-board programming modes and one off-board programming mode
⎯ Boot mode
• One off-board programming mode
• Protection modes
Rev.6.00 Mar. 18, 2009 Page 718 of 980
REJ09B0050-0600
⎯ User program mode
⎯ User boot mode
⎯ PROM mode
There are two protection modes: software protection by the register setting and hardware
protection by the FWE pin. The protection state for flash memory programming/erasing can be
set.
This mode is a program mode that uses an on-chip SCI interface. The user MAT and user
boot MAT can be programmed. This mode can automatically adjust the bit rate between
host and this LSI.
The user MAT can be programmed by using the optional interface.
The user boot program of the optional interface can be made and the user MAT can be
programmed.
This mode uses the PROM programmer. The user MAT and user boot MAT can be
programmed.

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