MCF5272VF66 Freescale, MCF5272VF66 Datasheet - Page 13
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MCF5272VF66
Manufacturer Part Number
MCF5272VF66
Description
Manufacturer
Freescale
Datasheet
1.MCF5272VF66.pdf
(544 pages)
Specifications of MCF5272VF66
Family Name
MCF5xxx
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
66MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
3.3V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
196
Package Type
MA-BGA
Lead Free Status / RoHS Status
Not Compliant
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Paragraph
Number
1.1 MCF5272 Key Features ................................................................................................................. 1-1
1.2 MCF5272 Architecture .................................................................................................................. 1-4
1.3
1.4 MCF5272-Specific Features .......................................................................................................... 1-7
2.1 Features and Enhancements ........................................................................................................... 2-1
2.2 Programming Model ...................................................................................................................... 2-4
Freescale Semiconductor
1.2.1 Version 2 ColdFire Core ..................................................................................................... 1-4
1.2.2 System Integration Module (SIM) ...................................................................................... 1-5
1.2.3 UART Module .................................................................................................................... 1-6
1.2.4 Timer Module ..................................................................................................................... 1-7
1.2.5 Test Access Port ................................................................................................................. 1-7
1.3.1 System Bus Configuration .................................................................................................. 1-7
1.4.1 Physical Layer Interface Controller (PLIC) ....................................................................... 1-7
1.4.2 Pulse-Width Modulation (PWM) Unit ............................................................................... 1-8
1.4.3 Queued Serial Peripheral Interface (QSPI) ........................................................................ 1-8
1.4.4 Universal Serial Bus (USB) Module .................................................................................. 1-8
2.1.1 Decoupled Pipelines ........................................................................................................... 2-1
2.1.2 Debug Module Enhancements ............................................................................................ 2-4
2.2.1 User Programming Model .................................................................................................. 2-4
System Design .............................................................................................................................. 1-7
1.2.2.1 External Bus Interface .......................................................................................... 1-5
1.2.2.2 Chip Select and Wait State Generation ................................................................. 1-5
1.2.2.3 System Configuration and Protection ................................................................... 1-5
1.2.2.4 Power Management .............................................................................................. 1-6
1.2.2.5 Parallel Input/Output Ports ................................................................................... 1-6
1.2.2.6 Interrupt Inputs ..................................................................................................... 1-6
2.1.1.1 Instruction Fetch Pipeline (IFP) ............................................................................ 2-2
2.1.1.2 Operand Execution Pipeline (OEP) ...................................................................... 2-2
2.2.1.1 Data Registers (D0–D7) ....................................................................................... 2-5
2.1.1.2.1 Illegal Opcode Handling .............................................................................. 2-3
2.1.1.2.2 Hardware Multiply/Accumulate (MAC) Unit.............................................. 2-3
2.1.1.2.3 Hardware Divide Unit.................................................................................. 2-4
MCF5272 ColdFire
Table of Contents
®
Integrated Microprocessor User’s Manual, Rev. 3
ColdFire Core
Chapter 1
Chapter 2
Overview
Title
Number
Page
xiii
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