MCF5272VF66 Freescale, MCF5272VF66 Datasheet - Page 28
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MCF5272VF66
Manufacturer Part Number
MCF5272VF66
Description
Manufacturer
Freescale
Datasheet
1.MCF5272VF66.pdf
(544 pages)
Specifications of MCF5272VF66
Family Name
MCF5xxx
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
66MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
3.3V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
196
Package Type
MA-BGA
Lead Free Status / RoHS Status
Not Compliant
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Paragraph
Number
19.17 JTAG Test Access Port and BDM Debug Port ...................................................................... 19-35
19.18 Operating Mode Configuration Pins ...................................................................................... 19-37
19.19 Power Supply Pins ................................................................................................................. 19-38
20.1 Features ...................................................................................................................................... 20-1
20.2 Bus and Control Signals ............................................................................................................ 20-1
20.3 Bus Exception: Double Bus Fault .............................................................................................. 20-3
20.4 Bus Characteristics .................................................................................................................... 20-3
20.5 Data Transfer Mechanism .......................................................................................................... 20-4
20.6 External Bus Interface Types ..................................................................................................... 20-7
20.7 Burst Data Transfers ................................................................................................................ 20-17
20.8 Misaligned Operands ............................................................................................................... 20-18
20.9 Interrupt Cycles ........................................................................................................................ 20-19
20.10 Bus Errors .............................................................................................................................. 20-19
20.11 Bus Arbitration ....................................................................................................................... 20-21
xxviii
19.16.3 GCI/IDL TDM Ports 2 and 3 ...................................................................................... 19-34
19.17.1 Test Clock (TCK/PSTCLK) ........................................................................................ 19-35
19.17.2 Test Mode Select and Force Breakpoint (TMS/BKPT) .............................................. 19-35
19.17.3 Test and Debug Data Out (TDO/DSO) ...................................................................... 19-36
19.17.4 Test and Debug Data In (TDI/DSI) ............................................................................ 19-36
19.17.5 JTAG TRST and BDM Data Clock (TRST/DSCLK) ................................................ 19-36
19.17.6 Freescale Test Mode Select (MTMOD) ..................................................................... 19-36
19.17.7 Debug Transfer Error Acknowledge (TEA) ............................................................... 19-36
19.17.8 Processor Status Outputs (PST[3:0]) .......................................................................... 19-36
19.17.9 Debug Data (DDATA[3:0]) ........................................................................................ 19-37
19.17.10 Device Test Enable (TEST) ...................................................................................... 19-37
20.2.1 Address Bus (A[22:0]) ................................................................................................... 20-2
20.2.2 Data Bus (D[31:0]) ......................................................................................................... 20-2
20.2.3 Read/Write (R/W) ........................................................................................................... 20-2
20.2.4 Transfer Acknowledge (TA) ........................................................................................... 20-2
20.2.5 Transfer Error Acknowledge (TEA) ............................................................................... 20-3
20.5.1 Bus Sizing ....................................................................................................................... 20-4
20.6.1 Interface for FLASH/SRAM Devices with Byte Strobes ............................................... 20-8
20.6.2 Interface for FLASH/SRAM Devices without Byte Strobes ........................................ 20-12
19.16.2.6 D-Channel Grant (DGNT1_INT6/PA15_INT6) ........................................... 19-33
19.16.3.1 GCI/IDL Delayed Frame Sync 2 (DFSC2/PA12) ......................................... 19-34
19.16.3.2 GCI/IDL Delayed Frame Sync 3 (DFSC3/PA13) ......................................... 19-34
19.16.3.3 QSPI_CS3, Port 3 GCI/IDL Data Out 3, PA7 (PA7/DOUT3/QSPI_CS3) ... 19-34
19.16.3.4 INT4 and Port 3 GCI/IDL Data In (INT4/DIN3) ......................................... 19-35
MCF5272 ColdFire
Table of Contents (Continued)
®
Integrated Microprocessor User’s Manual, Rev. 3
Bus Operation
Chapter 20
Title
Freescale Semiconductor
Number
Page
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