AMD-K6-IIIE+550ACR AMD (ADVANCED MICRO DEVICES), AMD-K6-IIIE+550ACR Datasheet - Page 316

• Manufacturer Part Number: AMD-K6-IIIE+550ACR
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of AMD-K6-IIIE+550ACR

• Lead Free Status / RoHS Status: Not Compliant

AMD-K6™-IIIE+ Embedded Processor Data Sheet
Decoupling
Recommendations
294
Figure 103. Suggested Component Placement for CPGA Package
In addition to the isolation region mentioned in “Power
Connections” on page 293, adequate decoupling capacitance is
required between the two system power planes and the ground
plane to minimize ringing and to provide a low-impedance path
for return currents. Suggested decoupling capacitor placement
is shown in Figure 103.
Surface-mounted capacitors should be used under the
processor’s ZIF socket to minimize resistance and inductance in
the lead lengths while maintaining minimal height. For
information and recommendations about the specific value,
quantity, and location of the capacitors, see the AMD-K6
Processor Power Supply Design Application Note, order# 21103.
Preliminary Information
V
CC3
Electrical Data
(I/O) Plane
C13
C12
C11
C5
C6
C7
C1
C2
+
+
C26
C18
CC5
CC6
V
CC3
CC4
0.254mm (min.) for
isolation region
CC2
C19
C27
C28
C17
CC1
(Core) Plane
+
+
+
C24
C20
C21
C22
C23
C25
C29
C30
C31
CC2
23543A/0—September 2000
Chapter 15
®