AMD-K6-IIIE+550ACR AMD (ADVANCED MICRO DEVICES), AMD-K6-IIIE+550ACR Datasheet - Page 341

• Manufacturer Part Number: AMD-K6-IIIE+550ACR
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of AMD-K6-IIIE+550ACR

• Lead Free Status / RoHS Status: Not Compliant

23543A/0—September 2000
17.2
17.3
Voltage Regulator
Chapter 17
Measuring Case Temperature
Layout and Airflow Considerations
The processor case temperature is measured to ensure that the
t h e r m a l s o l u t i o n m e e t s t h e p ro c e s s o r ’s o p e ra t i o n a l
specification. This temperature should be measured on the top
center of the package, where most of the heat is dissipated.
Figure 116 shows the correct location for measuring the case
temperature. The tip of the thermocouple should be secured to
the package surface with a small amount of thermally
conductive epoxy. It is also recommended to secure a second
location along the thermocouple to avoid any movement during
testing.
If a heatsink is installed while measuring, the thermocouple
must be installed into the heatsink via a small hole drilled
through the heatsink base (for example, 1/16 of an inch). Secure
the thermocouple to the base of the heatsink by filling the
small hole with thermal epoxy, allowing the tip of the
thermocouple to protrude the epoxy and touch the top of the
processor case.
Figure 116. Measuring Case Temperature
A voltage regulator is required to support the lower voltage
(3.3 V and lower) to the processor. In most applications, the
voltage regulator is designed with power transistors. As a
result, additional heatsinks are required to dissipate the heat
from the power transistors. Figure 117 on page 320 shows the
Thermal Design
AMD-K6™-IIIE+ Embedded Processor Data Sheet
Thermally Conductive Epoxy
Thermocouple
319