AMD-K6-IIIE+550ACR AMD (ADVANCED MICRO DEVICES), AMD-K6-IIIE+550ACR Datasheet - Page 340

• Manufacturer Part Number: AMD-K6-IIIE+550ACR
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of AMD-K6-IIIE+550ACR

• Lead Free Status / RoHS Status: Not Compliant

AMD-K6™-IIIE+ Embedded Processor Data Sheet
Heat Dissipation Path
318
The thermal resistance of a heatsink is determined by the heat
dissipation surface area, the material and shape of the
heatsink, and the airflow volume across the heatsink. In
general, the larger the surface area the lower the thermal
resistance.
The required thermal resistance of a heatsink (
calculated using the following example:
If:
Then:
Thermal grease is recommended as interface material because
it provides the lowest thermal resistance (@ 0.20°C/W). The
required thermal resistance (
example is calculated as follows:
Figure 115 illustrates the heat dissipation path of the processor.
Due to the lower thermal resistance between the processor die
junction and case, most of the heat generated by the processor
is transferred from the top surface of the case. The small
amount of heat generated from the bottom side of the processor
where the processor socket blocks the convection can be safely
ignored.
Figure 115. Processor Heat Dissipation Path
T
T
P
q
SA
C
A
MAX
= 70°C
= 45°C
= q
= 19.50W
Preliminary Information
CA
q
– q
CA
Thermal Design
IF
ˆ
Ë
Í
T
------------------- -
= 1.28 – 0.20 = 1.08°C/W
P
C
MAX
–
T
A
Ambient Temperature
Û
Ý
Case temperature
=
------------------ -
19.50W
25•C
q
SA
) of the heatsink in this
=
1.28•C W
23543A/0—September 2000
‰
Thin Lid
q
SA
) can be
Chapter 17