AMD-K6-IIIE+550ACR AMD (ADVANCED MICRO DEVICES), AMD-K6-IIIE+550ACR Datasheet - Page 339

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AMD-K6-IIIE+550ACR

Manufacturer Part Number
AMD-K6-IIIE+550ACR
Description
Manufacturer
AMD (ADVANCED MICRO DEVICES)
Datasheet

Specifications of AMD-K6-IIIE+550ACR

Lead Free Status / RoHS Status
Not Compliant
23543A/0—September 2000
Figure 114. Power Consumption and Thermal Resistance (CPGA Package)
Chapter 17
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Figure 113. Thermal Model (CPGA Package)
Figure 114 illustrates the case-to-ambient temperature (T
relation to the power consumption (X-axis) and the thermal
resistance (Y-axis). If the power consumption and case
te mpe rat ure are known, t he ther mal re sista nce (
requirement can be calculated for a given ambient temperature
(T
A
) value.
Temperature
(Ambient)
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T
CA
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Thermal Design
Power Consumption (Watts)
Sink
Case
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AMD-K6™-IIIE+ Embedded Processor Data Sheet
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Case-to-Ambient Temperature
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T
CA
(T
= T
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- T
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Resistance
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Thermal
)
(°C/W)
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