D12332VFC25 Renesas Electronics America, D12332VFC25 Datasheet - Page 183

• Manufacturer Part Number: D12332VFC25
• Description: MCU 3V 0K 144-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of D12332VFC25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 106
• Program Memory Type: ROMless
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 4x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -
• Other names: HD6412332VFC25; HD6412332VFC25

Table 6.3
ABWCR
ABWn
0
1
6.3.3
The chip’s interfaces comprise a basic bus interface that allows direct connection of ROM,
SRAM, and so on; a DRAM interface that allows direct connection of DRAM; and a burst ROM
interface that allows direct connection of burst ROM. The interface can be selected independently
for each area.
An area for which the basic bus interface is designated functions as normal space, an area for
which the DRAM interface is designated functions as DRAM space, and an area for which the
burst ROM interface is designated functions as burst ROM space.
Memory Interfaces
ASTCR
ASTn
0
1
0
1
Bus Specifications for Each Area (Basic Bus Interface)
Wn1
—
0
1
—
0
1
WCRH, WCRL
Wn0
—
0
1
0
1
—
0
1
0
1
Bus Width
16
8
Bus Specifications (Basic Bus Interface)
Rev.4.00 Sep. 07, 2007 Page 151 of 1210
Access States
2
3
2
3
Program Wait States
0
0
1
2
3
0
0
1
2
3
REJ09B0245-0400