D12332VFC25 Renesas Electronics America, D12332VFC25 Datasheet - Page 199

MCU 3V 0K 144-QFP

D12332VFC25

Manufacturer Part Number
D12332VFC25
Description
MCU 3V 0K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of D12332VFC25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
106
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412332VFC25
HD6412332VFC25

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12332VFC25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
6.5
6.5.1
When the chip is in advanced mode, external space areas 2 to 5 can be designated as DRAM
space, and DRAM interfacing performed. With the DRAM interface, DRAM can be directly
connected to the chip. A DRAM space of 2, 4, or 8 Mbytes can be set by means of bits RMTS2 to
RMTS0 in BCRH. Burst operation is also possible, using fast page mode.
6.5.2
Areas 2 to 5 are designated as DRAM space by setting bits RMTS2 to RMTS0 in BCRH. The
relation between the settings of bits RMTS2 to RMTS0 and DRAM space is shown in table 6.4.
Possible DRAM space settings are: one area (area 2), two areas (areas 2 and 3), and four areas
(areas 2 to 5).
Table 6.4
RMTS2
0
DRAM Interface
Overview
Setting DRAM Space
RMTS1
0
1
DRAM Space Settings by Bits RMTS2 to RMTS0
RMTS0
1
0
1
Area 5
Normal space
Normal space
DRAM space
Area 4
Normal space
Normal space
DRAM space
Rev.4.00 Sep. 07, 2007 Page 167 of 1210
Area 3
Normal space
DRAM space
DRAM space
REJ09B0245-0400
Area 2
DRAM space
DRAM space
DRAM space

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