D12332VFC25 Renesas Electronics America, D12332VFC25 Datasheet - Page 216

• Manufacturer Part Number: D12332VFC25
• Description: MCU 3V 0K 144-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of D12332VFC25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 106
• Program Memory Type: ROMless
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 4x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -
• Other names: HD6412332VFC25; HD6412332VFC25

6.6.2
When DRAM space is accessed in DMAC single address mode, full access (normal access) is
always performed. With the DRAM interface, the DACK output goes low from the T
In modes other than DMAC single address mode, burst access can be used when accessing DRAM
space.
Figure 6.29 shows the DACK output timing for the DRAM interface when DDS = 0.
Rev.4.00 Sep. 07, 2007 Page 184 of 1210
REJ09B0245-0400
Note: n = 2 to 5
Read
Write
Figure 6.29 DACK Output Timing when DDS = 0 (Example of DRAM Access)
When DDS = 0
A
CS
CAS (UCAS)
LCAS (LCAS)
HWR (WE)
D
HWR (WE)
D
DACK
φ
23
15
15
n
to A
to D
to D
(RAS)
0
0
0
T
p
Row
T
r
T
c1
Column
T
c2
r
state.