D12332VFC25 Renesas Electronics America, D12332VFC25 Datasheet - Page 209

MCU 3V 0K 144-QFP

D12332VFC25

Manufacturer Part Number
D12332VFC25
Description
MCU 3V 0K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of D12332VFC25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
106
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412332VFC25
HD6412332VFC25

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12332VFC25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
RAS Down Mode and RAS Up Mode: Even when burst operation is selected, it may happen that
access to DRAM space is not continuous, but is interrupted by access to another space. In this
case, if the RAS signal is held low during the access to the other space, burst operation can be
resumed when the same row address in DRAM space is accessed again.
• RAS down mode
Note: n = 2 to 5
A
CS
CAS, LCAS
D
To select RAS down mode, set the RCDM bit in MCR to 1. If access to DRAM space is
interrupted and another space is accessed, the RAS signal is held low during the access to the
other space, and burst access is performed when the row address of the next DRAM space
access is the same as the row address of the previous DRAM space access. Figure 6.21 shows
an example of the timing in RAS down mode.
Note, however, that the RAS signal will go high if a refresh operation occurs during RAS
down mode.
φ
23
15
n
to A
to D
(RAS)
0
0
Figure 6.21 Example of Operation Timing in RAS Down Mode
T
p
DRAM access
T
r
T
c1
T
c2
Rev.4.00 Sep. 07, 2007 Page 177 of 1210
space access
T
1
External
T
2
DRAM access
T
c1
REJ09B0245-0400
T
c2

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