MC9S12E128CPV Freescale Semiconductor, MC9S12E128CPV Datasheet - Page 567
![Microcontrollers (MCU) 16 Bit 16MHz](/photos/38/0/380047/lqfp-112_sml.jpg)
MC9S12E128CPV
Manufacturer Part Number
MC9S12E128CPV
Description
Microcontrollers (MCU) 16 Bit 16MHz
Manufacturer
Freescale Semiconductor
Datasheet
1.MC9S12E128CPV.pdf
(606 pages)
Specifications of MC9S12E128CPV
Data Bus Width
16 bit
Program Memory Type
Flash
Program Memory Size
128 KB
Data Ram Size
8 KB
Interface Type
SCI, SPI
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
92
Number Of Timers
16 bit
Operating Supply Voltage
3.135 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
LQFP-112
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
On-chip Dac
8 bit, 2 Channel
Lead Free Status / Rohs Status
No RoHS Version Available
Available stocks
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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S12E128CPVE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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A.1.7
This chapter describes the operating conditions of the device. Unless otherwise noted those conditions
apply to all the following data.
1
2
A.1.8
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (T
obtained from:
The total power dissipation can be calculated from:
Freescale Semiconductor
I/O, Regulator and Analog Supply Voltage
Internal Logic Supply Voltage
PLL Supply Voltage
Voltage Difference VDDX to VDDA
Voltage Difference VSSX to VSSR and VSSA
Oscillator
Bus Frequency
Operating Junction Temperature Range
The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The given
operating range applies when this regulator is disabled and the device is powered from an external source.
Some blocks e.g. ATD (conversion) and NVMs (program/erase) require higher bus frequencies for proper operation.
T
T
T
P
P
P
J
J
A
D
JA
D
INT
=
=
=
=
=
=
T
Junction Temperature, [ C
Ambient Temperature, [ C
Total Chip Power Dissipation, [W]
=
P
A
Package Thermal Resistance, [ C/W]
INT
Operating Conditions
Power Dissipation and Thermal Characteristics
Chip Internal Power Dissipation, [W]
+
2
Instead of specifying ambient temperature all parameters are specified for
the more meaningful silicon junction temperature. For power dissipation
calculations refer to
Characteristics”.
P
+
D
1
P
IO
JA
Rating
1
Section A.1.8, “Power Dissipation and Thermal
Table A-4. Operating Conditions
MC9S12E128 Data Sheet, Rev. 1.07
NOTE
Symbol
V
V
V
DDPLL
VDDX
VSSX
f
f
DD5
osc
bus
T
DD
J
2.97
2.35
2.35
–0.1
–0.1
0.25
Min
–40
0.5
Appendix A Electrical Characteristics
3.3/5
Typ
2.5
2.5
—
—
—
0
0
Max
2.75
2.75
140
J
5.5
0.1
0.1
16
25
) in C can be
MHz
MHz
Unit
V
V
V
V
V
C
567
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