AMD-K6-IIIE+550ACR AMD (ADVANCED MICRO DEVICES), AMD-K6-IIIE+550ACR Datasheet - Page 343

• Manufacturer Part Number: AMD-K6-IIIE+550ACR
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of AMD-K6-IIIE+550ACR

• Lead Free Status / RoHS Status: Not Compliant

23543A/0—September 2000
Airflow Management
in a System Design
Chapter 17
Figure 118. Airflow for a Heatsink with Fan
Complete airflow management in a system is important. In
addition to the volume of air, the path of the air is also
important. Figure 119 shows the airflow in a dual-fan system.
The fan in the front end pulls cool air into the system through
intake slots in the chassis. The power supply fan forces the hot
air out of the chassis. The thermal performance of the heatsink
can be maximized if it is located in the shaded area, where it
receives greatest benefit from this air exchange system.
Figure 119. Airflow Path in a Dual-Fan System
e
n
t
s
V
Thermal Design
Vents
Fan
Main Board
AMD-K6™-IIIE+ Embedded Processor Data Sheet
Ideal areas for voltage regulator
Airflow
Front
Drive Bays
Fan
P/S
321