LPC1769FBD100,551 NXP Semiconductors, LPC1769FBD100,551 Datasheet - Page 414
LPC1769FBD100,551
Manufacturer Part Number
LPC1769FBD100,551
Description
IC ARM CORTEX MCU 512K 100-LQFP
Manufacturer
NXP Semiconductors
Series
LPC17xxr
Datasheets
1.OM11043.pdf
(79 pages)
2.LPC1767FBD100551.pdf
(2 pages)
3.LPC1767FBD100551.pdf
(840 pages)
4.LPC1769FBD100551.pdf
(66 pages)
Specifications of LPC1769FBD100,551
Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
100-LQFP
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
120MHz
Connectivity
CAN, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
70
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 3.6 V
Data Converters
A/D 8x12b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC17
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
Ethernet, USB, OTG, CAN
Maximum Clock Frequency
120 MHz
Number Of Programmable I/os
70
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, MCB1760, MCB1760U, MCB1760UME
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 8 Channel
On-chip Dac
10 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4966
935290522551
935290522551
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC1769FBD100,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
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NXP Semiconductors
UM10360
User manual
Fig 76. Texas Instruments Synchronous Serial Frame Format: a) Single and b) Continuous/back-to-back Two
a. Single frame transfer
b. Continuous/back-to-back frames transfer
Frames Transfer
DX/DR
18.5.2.1 Clock Polarity (CPOL) and Phase (CPHA) control
CLK
18.5.2 SPI frame format
FS
For device configured as a master in this mode, CLK and FS are forced LOW, and the
transmit data line DX is tri-stated whenever the SSP is idle. Once the bottom entry of the
transmit FIFO contains data, FS is pulsed HIGH for one CLK period. The value to be
transmitted is also transferred from the transmit FIFO to the serial shift register of the
transmit logic. On the next rising edge of CLK, the MSB of the 4-bit to 16-bit data frame is
shifted out on the DX pin. Likewise, the MSB of the received data is shifted onto the DR
pin by the off-chip serial slave device.
Both the SSP and the off-chip serial slave device then clock each data bit into their serial
shifter on the falling edge of each CLK. The received data is transferred from the serial
shifter to the receive FIFO on the first rising edge of CLK after the LSB has been latched.
The SPI interface is a four-wire interface where the SSEL signal behaves as a slave
select. The main feature of the SPI format is that the inactive state and phase of the SCK
signal are programmable through the CPOL and CPHA bits within the SSPCR0 control
register.
When the CPOL clock polarity control bit is 0, it produces a steady state low value on the
SCK pin. If the CPOL clock polarity control bit is 1, a steady state high value is placed on
the CLK pin when data is not being transferred.
DX/DR
CLK
FS
MSB
All information provided in this document is subject to legal disclaimers.
4 to 16 bits
Rev. 2 — 19 August 2010
MSB
LSB
4 to 16 bits
MSB
LSB
4 to 16 bits
Chapter 18: LPC17xx SSP0/1
LSB
UM10360
© NXP B.V. 2010. All rights reserved.
414 of 840
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